Contact: 978-446-0003

Materials We Cut

dicingusa.coma capabilitiesYour cutting source for all hard and brittle materials:

Glass – all types including:

  • Filter glass
  • Optics: concave/convex
  • Sapphire
  • Quartz
  • Fused Silica

Ceramics – all types including:

  • ZTA
  • LTCC
  • Beryllium oxide
  • 99% Aluminum oxide
  • Aluminum nitride

Silicon

FR-4, PCB Laminate materials with ESD capabilities

More than just dicing.

We don’t just cut. We also machine slots, grooves, bevels, chamfers, v-grooves, much more. Feel free to get in touch via email or phone for more information about our hard and brittle material machining capabilities.

No size limitations.

We are unique among dicing vendors in that we have a wide range of cutting equipment to cut almost any size and shape. Some of the sizes we most commonly cut are: 8” diameter and 6.5” square. 0.500” (12.7 mm) thick.