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Monthly Archive for: ‘January, 2015’

  • Thick Material Dicing

    Considerations for Extra Thick Material Dicing

    Many different applications require very thick material dicing in order to reach the needed size. Applications such as heat shields, imprint masks, and certain substrates require materials which are thicker than those used in other more common applications. Ceramics, glass, quartz, and some types of …

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  • Wafer Dicing

    Wafer Dicing

    Wafers are thin slices of silicon that are used in many types of electronics applications. The wafers are grown in a lab setting in which purity is controlled and altered depending on the destined use of the wafer. Wafer dicing is a process used to …

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