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Monthly Archive for: ‘February, 2015’

  • Dicing Tape

    Selecting the Right Dicing Tape

    Die preparation is one step of the process that is used in semiconductor fabrication. During die preparation, it is necessary to properly mount and dice wafers. While there are several methods that can be used to mount wafers, using dicing tape is very common. Dicing …

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  • Sapphire Semiconductor Wafer

    Working with Sapphire

    Sapphire is increasing in use in a variety of manufacturing applications. Synthetic sapphire can sometimes be carefully grown into desired shapes and sizes, but in most cases it must be machined to specifications to be used properly. We at Innovative Fabrication have many years of …

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