Optimizing the dicing process can help to improve product yields, cut quality, and precision in a variety of applications. Optimizing the dicing process can also help to increase the life of diamond blades and other equipment. In order to optimize dicing processes, it is necessary to consider all of the parameters involved in a dicing project. Depending on the details of the project, some or most of the parameters may need to be optimized.
Adjust Spindle Speed
Different spindle speeds will work best for different materials. Material hardness, density, and thickness should all be taken into consideration when selecting the spindle speed, as these factors coupled with the spindle speed will determine the cut quality. Low spindle RPMs will often cause the blade to wear faster to maintain cut quality. Higher spindle RPMs will save the blade, but possibly affect the quality of the cuts. More material is removed when spindle speeds are lower.
Determine Best Feed Rate
The desired cut quality and material hardness, density, and thickness will also come into play when determining the best feed rate for a project. Many projects are done with a focus on cutting as much material as possible in as short amount of time as possible. This may sacrifice the quality of the cuts however, and cause materials to be wasted as chipping and cracking occurs.
Select the Right Type of Saw
The saw that is selected will have a huge impact on the quality and the cost of the end product. The best saw for the job may vary widely depending on the material that is being used and the project. There are many different types of diamond saws, and characteristics such as grit size, diamond shape, diamond type, and diamond distribution range and concentration may all affect the precision of the cut and the quality of the finished project. The blade size and the optimal machine for the job should also be considered, as not all blades will fit all machines.
Consider Different Mounting Media Options
Tape is often used to mount materials for dicing. However, tape presents inefficiencies, in some cases. Dicing through tape may cause materials to chip at the point of contact with the tape, but tape is easy to handle and can be used for the dicing process and then later on for the die bonding process when performing microelectronics fabrications. Glue and wax can be used to mount a substrate to solid media, which is often superior for blade performance. However, handling is often more difficult and die components may become damaged by waxes with high melting points.