Contact: 978-446-0003


All Posts Tagged Tag: ‘dicing’

  • Dicing Challenges

    5 Ways to Overcome Dicing Challenges

    Diamond dicing is a process that must be skillfully executed in order to yield quality products at high production volumes. Diamond dicing is best performed by experts, as there are many challenges that one may encounter while dicing materials. The following are a few ways …

    Read More →
  • Silicon Dicing

    Silicon Dicing for Success

    Silicon wafers, which are thin slivers of silicon created in a lab setting, are diced using a diamond saw to divide them into individual units. While other methods may be used, diamond dicing holds advantages over these methods. After a wafer has been diced, the …

    Read More →
  • Dicing Optimization

    4 Tips for Optimizing the Dicing Process

    Optimizing the dicing process can help to improve product yields, cut quality, and precision in a variety of applications. Optimizing the dicing process can also help to increase the life of diamond blades and other equipment. In order to optimize dicing processes, it is necessary …

    Read More →
  • Dicing Coolant

    Basics of Coolant Usage in Diamond Dicing

    Before taking on a diamond dicing project, it is important to understand how coolant usage will affect the process and the results. When coolant is used during the dicing process, the velocity of the fluid stream, the type of coolant, the size of the nozzle, …

    Read More →
  • Sapphire Semiconductor Wafer

    Working with Sapphire

    Sapphire is increasing in use in a variety of manufacturing applications. Synthetic sapphire can sometimes be carefully grown into desired shapes and sizes, but in most cases it must be machined to specifications to be used properly. We at Innovative Fabrication have many years of …

    Read More →
  • Wafer Dicing

    Wafer Dicing

    Wafers are thin slices of silicon that are used in many types of electronics applications. The wafers are grown in a lab setting in which purity is controlled and altered depending on the destined use of the wafer. Wafer dicing is a process used to …

    Read More →
  • Machining Brittle Materials

    Machining Brittle Materials

    Brittle materials can be amongst the most difficult to machine. However, machining brittle materials with precision is crucial for the manufacture of devices for a wide range of different industries. Traditional machining processes may lack the accuracy required to level surfaces of brittle materials as …

    Read More →
  • Ceramic Fabrication

    Ceramic Fabrication 101

    The term ceramic fabrication can refer to a number of different materials. By definition, ceramic materials are non-metallic, inorganic materials that are made from compounds of a non-metal and a metal. In general, ceramic materials do not conduct electricity or heat and are known to …

    Read More →
  • Direct Copper Bond Dicing

    Direct Bond Copper Dicing

    Direct bond copper, or DBC, has been gaining popularity due to its high thermal conductivity and strength. DBC substrates are created by bonding copper to one or both sides of a ceramic material. When the copper is bonded to the ceramic surface, usually alumina or …

    Read More →
  • Diamond Blade Uses

    Diamond Blade Industry Uses

    Many industries benefit from the use of diamond blade services, even where other types of blade services may be used. A diamond blade has diamond grains set into the cutting edge. This gives diamond blades the ability to cut through harder or brittle materials and …

    Read More →