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All Posts Tagged Tag: ‘wafer dicing process’

  • Dicing Tape

    Selecting the Right Dicing Tape

    Die preparation is one step of the process that is used in semiconductor fabrication. During die preparation, it is necessary to properly mount and dice wafers. While there are several methods that can be used to mount wafers, using dicing tape is very common. Dicing …

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  • Wafer Dicing

    Wafer Dicing

    Wafers are thin slices of silicon that are used in many types of electronics applications. The wafers are grown in a lab setting in which purity is controlled and altered depending on the destined use of the wafer. Wafer dicing is a process used to …

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